2024年5月6日发(作者：)

设计指南：面向英特尔至强处理器的mGA604

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DesignGuide:mPGA604SocketforIntel?Xeon?Processors

Thisdocumentdefinesasurfacemount,ZeroInsertionForce

(ZIF)socketintendedforworkstationandserverplatforms

basedonIntel?ketprovidesI/O,power,

ketcontains604contactsarrayed

aboutacavityinthecenterofthesocketwithsolder

balls/surfacemountfeaturesforsurfacemountingwiththe

A604Socketcontactshave1.27mmpitchwith

regularpinarray,tomatewitha604-pinprocessorpackage.

A604-pinpackagewillbematedwitha603solderballsocket.

Thedummypinisakeythatallowseitherthe603-pinprocessor

packageorthe604-pinprocessorpackagetobeusedinthesame

socket.

1.2Purpose

Todefinefunctional,quality,reliability,andmaterial(that

is,visual,dimensional,andphysical)requirementsanddesign

guidelinesofthemPGA604Socketinordertoprovidelowcost,

lowrisk,robust,highvolumemanufacturable(HVM)socket

solutionavailablefrommultiplesources.

1.3Scope

Thisdesignguidelineappliestoall604-pinZIFsockets

purchasedtotherequirementsofthisdesignguideline.

Readthefull

Processors.

DesignGuidemPGA604SocketforIntel?Xeon?