2024年3月21日发(作者：)
半导体词汇缩写表
Revised by Petrel at 2021
半导体词汇缩写表
A/D
AA
AAS
ABC
ABM
AC
ACF
ACI
ACP
ACT
ADC
ADE
ADI
ADT
ADTSEM
AE
AEC
AECS
AEI
AEM
AES
AFM
AFP
Ag
A-GEMTF
AGV
AHF
AHU
AIR
Al
ALD
ALE
ALS
AMC
AMHS
AMT
AMU
ANN
ANOVA
AOV
AP
APA
APC
APCD
APCFI
APCVD
analogtodigital
atomicabsorption
atomicabsorptionspectroscopy
activity-basedcosting
activity-basedmanagement
alternatingcurrent;activatedcarbon
anisotropicconductivefilm
after-cleaninspection
anisotropicconductivepaste
alternativecontroltechniques;actualcycletime
analog-to-digitalconverter
advanceddevelopmentenvironment
after-developinspection
applieddiagnostictechnique
Apply/DevelopTrackSpecificEquipmentModel
atomicemission;acousticemission;absoluteellipsometry
advancedequipmentcontroller
AdvancedEquipmentControlSystem;AutomatedEquipmentControlSystem
after-etchinspection;automatedequipmentinterface
analyticalelectronmicroscopy
Augeremission/electronspectroscopy
atomicforcemicroscopy
abrasive-freepolish
silver
AdvancedGEMTaskForce
automatedguidedvehicle
anhydroushydrogenfluoride
airhandlingunit
automatedimageretrieval
aluminum
atomiclayerdeposition
atomiclayerepitaxy;applicationlogicelement
advancedlightsource;advancedlow-powerSchottky
airbornemolecularcontamination
automatedmaterialhandlingsystem
advancedmanufacturingtechnology
atomicmassunit
artificialneuralnetwork
analysisofvariance
air-operatedvalve
adhesionpromoter
advancedperformancealgorithm
advancedprocesscontrol
add-onpollutioncontroldevice
AdvancedProcessControlFrameworkInitiative
atmosphericpressurechemicalvapordeposition
APEC
API
APM
APRDL
aPSM
AQI
AQL
Ar
AR
ARAMS
ARC
ARDE
ARPA
ARS
As
AS/RS
ASAP
ASIC
ASO
ASP
ASR
ATDF
ATE
ATG
ATLAS
atm
ATP
ATR
Att
Au
AVP
AVS
AWE
AWISPM
AWS
B
Ba
BARC
BASE
BAW
BC
BDEV
BDS
Be
BEOL
BESOI
BF
BFGS
BFL
BGA
advancedprocessequipmentcontrol
applicationprogramminginterface;atmosphericpressureionization
atmosphericpassivationmodule;acousticplatemode
AdvancedProductsResearchandDevelopmentLaboratory
attenuatingphase-shiftmask
ACCESSqueryinterface
acceptablequalitylevel
argon
aspectratio
AutomatedReliability
antireflectivecoating
aspectratio-dependentetching
AdvancedResearchProjectsAgency(seeDARPA)
angle-resolvedscattering
arsenic
automatedstorageandretrievalsystem
AdvancedStepperApplicationProgram
application-specificintegratedcircuit
automaticshutoff
advancedstripandpassivation;advancedstripprocessor
automatedsendreceive
AdvancedToolDevelopmentFacility
automatictestequipment
automatictestgeneration
abbreviatedtestlanguageforallsystems
atmosphere
advancedtechnologyprogram;adenosinetriphosphate;acceptanceandtoolperformance
attenuatedtotalreflectance
attenuated
gold
advancedverticalprocessor
advancedvisualizationsystem
asymptoticwaveformevaluation
abovewaferinsituparticlemonitoring
advancedwetstation
billion;boron
barium
bottomantireflectivecoating
BostonAreaSemiconductorEducation(Council)
bulkacousticwave
biascontrast
behavior-leveldeviation
BrownianDynamicsSimulation
beryllium
backendofline
bondedandetchbacksilicononinsulator
brightfield
Broyden-Fletcher-Goldfarb-Shannooptimizationalgorithm
bufferedfield-effecttransistorlogic
ballgridarray
BHT
Bi
BiCMOS
BIFET
BIM
BiMOS
BIST
BIT
BITE
BMC
BMD
BOE
BOR
BOSS
BOX
BPR
BPSG
BPTEOS
Br
BSE
BTAB
BV
C
Ca
CA
CAA
CAB
CAD
CADT
CAE
CAI
CAM
CAPS
CAR
CARRI
CASE
CAT
CAW
CAWC
CBGA
CBS
CBT
CC
CCC
CCD
CCSL
CCW
Cd
CD
CD/OL
Brinellhardnesstest
bismuth
bipolarcomplementarymetal-oxidesemiconductor
bipolarfield-effecttransistor
binaryintensitymask
bipolarmetal-oxidesemiconductor
built-inself-test
bulkiontemperature
built-intestequipment
bubblememorycontroller
bulkmicrodefect
bufferedoxideetchant
bottomofrange
BookofSEMIStandards;binaryobjectstoragesystem
buriedoxide
beamprofilereflectometry;businessprocessreengineering
boronphosphosilicateglass
BPSGfromaTEOSsource
bromine
backscatteredelectrondetection
bumpedtapeautomatedbonding
breakdownvoltage
carbon
calcium
CIMarchitecture
CIMapplicationsarchitecture
CompetitiveAnalysisBenchmarking
computer-aideddesign
controlapplicationdevelopmenttool
computer-aidedengineering
computer-assistedinstruction
computer-aidedmanufacturing
computer-assistedproblemsolving
chemicallyamplifiedresist
ComputerizedAssessmentofRelativeRiskImpacts
computer-aidedsoftwareengineering;computer-aidedsystemsengineering
computer-aidedtesting
ConstructionAnalysisWorkgroup
cryogenicaerosolwafercleaning
ceramicballgridarray
chemicalbottlestoragearea
computer-basedtraining
chipcarrier;clustercontroller
ceramicchipcarrier
charge-coupleddevice
compatiblecurrent-sinkinglogic
counterclockwise
cadmium
criticaldimension
criticaldimensionoverlay
CDA
CDE
CDEM
CDI
CDM
CDO
CDR
CDS
Ce
CE
CEC
CEE
CEM
CER-DIP
CFA
CFC
CFD
CFM
CIC
CID
CIE
CIM
CIM-OSA
CIP
CIS
CISC
Cl
CLCC
CLIC
CM
CMC
CML
CMM
CMOS
CMP
CMR
CNC
CNT
Co
COB
COC
CODEC
COED
COGS
CoO
CORBA
CORE
COSS
COT
CoV
cleandryair
chemicaldownstreametch
CustomerDeliveryEnterpriseModel
collector-diffusionisolation
CommonDeviceModelforSAB
controlleddecomposition/oxidation
chemicaldistributionroom
chemicaldistributionsystem
cerium
capillaryelectrophoresis
cellevaluationchip
controlexecutionenvironment
continuousemissionsmonitoring
ceramicdualin-linepackage
componentfailureanalysis
chlorofluorocarbon
computationalfluiddynamics
contamination-freemanufacturing
cleanroominterfacechamber
charge-injectiondevice
computer-integratedengineering
computer-integratedmanufacturing
computer-integratedmanufacturing-opensystemsarchitecture(ESPRITprogram)
ContinuousImprovementProgram
CenterforIntegratedSystems
complexinstructionsetcomputer
chlorine
ceramicleadedchipcarrier
closed-loopintensitycontrol
configurationmanagement;cassettemodule
cassettemodulecontroller
currentmodelogic
capabilitymaturitymodel
complementarymetal-oxidesemiconductor
chemicalmechanicalplanarization
common-moderejectionratio;cancelmoverequest
computernumericalcontrol;condensationnucleuscounter
carbonnanotube
cobalt
chip-on-board
costofconsumables
coder-decoder
computer-optimizedexperimentaldesign
costofgoodssold
costofownership
commonobjectrequestbrokerarchitecture
compositeobjectreference
commonobjectservicesspecification
customer-ownedtooling
coefficientofvariance
Cp
CPD
CPE
CPGA
Cpk
CQFP
CQN
Cr
CRC
CRM
Cs
CSA
CSE
CSF
CSL
CSMA/CD
CSP
CSPED
CST
CSTR
CSV
CTC
CTE
CTI
CTMC
Cu
CUB
CUBES
CUI
CUSUM
CV
CVCM
CVD
CW
Cz
D/A
D/B
DAC
DAS
DASSL
DBMS
DC
DCA
DCATS
DCE
DCL
DCS
DDL
DDMS
DEDS
processcapability
concurrentproductdevelopment
Communications
ceramicpingridarray
processcapabilityindex
ceramicquadflatpack
closed-queuingnetwork
chromium
cyclicredundancycheck
Cost/ResourceModel
cesium
CIMsystemsarchitecture
controlsystemsengineering
criticalsuccessfactor
current-steeringlogic
carrier-sense
chip-scalepackage
concurrentsemiconductorproductionandequipmentdevelopment
CIMsystemstechnology
continuouslystirredtankreactor
comma-separatedvariable
clustertoolcontroller
coefficientofthermalexpansion
cycletimeimprovement
clustertoolmodularcommunications
copper
centralutilitybuilding
capacityutilizationbottleneckefficiencysystem
commonuserinterface
cumulativesum
capacitance-to-voltage
collectedvolatilecondensablematerials
chemicalvapordeposition
continuouswave
Czochralskiprocess
digitaltoanalog
diebonding
digital-to-analogconverter
directabsorptionspectroscopy
differentialalgebraicsystemsolver
databasemanagementsystem
directcurrent
directchipattachment
double-containedacidtransfersystem
distributedcomputerenvironment
digitalcommandlanguage;displaycommunicationlog
dichlorosilane
devicedescriptionlanguage
defectdatamanagementsystem
discrete-eventdynamicsimulation
DES
DF
DFC
DFE
DFM
DFR
DFT
DFY
DHF
DI
DIBL
DIC
DIL
DIP
DLBI
DLOC
DLS
DLT
DLTS
DMA
DMH
DML
DMM
DMOS
DMR
DO
DOA
DOAS
DOE
DOF
DOP
DPA
DPM
DPP
DPSRAM
DRAM
DRAPAC
DRC
DRE
DRIFTS
DRT
DSA
DSC
DSMC
DSQ
DSS
DSW
DT
DTA
DTC
dataencryptionstandard;displayequipmentstatus
darkfield
densifiedfluidclean
dual-frequencyetch
designformanufacturing
designforreliability
designfortest
designforyield
dilutehydrofluoricacid
deionized;dielectricisolation
drain-inducedbarrierleakage
differentialinterferencecontrast
dualin-line
dualin-linepackage
device-levelburn-in
developedsourcelinesofcode
displaylotstatus
device-leveltest
deep-leveltransientspectroscopy
directmemoryaccess;dynamicmechanicalanalysis
displaymessagehelps
datamanipulationlanguage;displaymessagelog
digitalmultimeter
diffusedmetal-oxidesemiconductor
displaymoverequests
dynamicoptimization
dead-onalignment
differentialopticalabsorptionspectroscopy
designofexperiments
depthoffocus
dioctylphthalate
destructivephysicalanalysis
digitalpanelmeter
discharge-producedplasma
dual-portstaticrandomaccessmemory
dynamicrandomaccessmemory
DesignRuleandProcessArchitectureCouncil
designrulecheck
destructionremovalefficiency
diffusereflectanceinfraredFouriertransformspectroscopy
defectreviewtool
displaysystemactivity;dimensionallystableanode
differentialscanningcalorimetry
directsimulationMonteCarlo
downstreamquartz
displaystockerstatus
directstep-on-wafer
dynamictest
differentialthermalanalysis
directthermocouplecontrol
DTL
DTM
DTMPN
DUT
DUV
DV
DVER
DVM
DVS
DWG
EAPSM
EAROM
EASE
e-beam
EBHT
EBIC
EBR
EC
ECA
ECAD
ECAE
ECL
ECN
ECO
ECQB
ECR
EDA
EDS
EDU
EDX
EDXA
EEDF
EELS
EEPROM
EFEM
EFOCS
EFTIR
EFV
EGE
EHS
EI
EID
EIP
EIS
EKF
ELF
EM
EMA
EMC
EMF
diodetransistorlogic
defecttestmonitor;delaytimemultiplier;devicetestmodule;digitalterrainmap
defecttestmonitorphasenumber
deviceundertest
deepultraviolet
designverification
designruleverification
digitalvoltmeter
displayvehiclestatus
domainworkgroup
embeddedattenuatedphase-shiftmask
electricallyalterableread-onlymemory
equipmentandsoftwareemulator
electronbeam
electron-beamhigh-throughputlithography
electronbeam-inducedcurrent
edgebeadremoval
engineeringchange;equipmentcontroller
engineeringcapabilityassessment
electroniccomputer-aideddesign;engineeringcomputer-aideddesign
electroniccomputer-aidedengineering
emittercoupledlogic
engineeringchangenotice
engineeringchangeorder
electrochemicalquartzcrystalbalance
electroncyclotronresonance
electronicdesignautomation
energy-dispersivespectroscopy
equipment-dependentuptime
energy-dispersiveX-ray
energy-dispersiveX-rayanalysis
electronenergydistributionfunction
electronenergy-lossspectroscopy
electricallyerasableprogrammableread-onlymemory
equipmentfront-endmodule
evanescentfiber-opticchemicalsensor
emissionFouriertransforminfraredspectroscopy
excessflowvalve
ethyleneglycolethers
extremelyhazardoussubstance
equipmentintegration
EquipmentInterfaceDevelopment
EquipmentImprovementProgram;EquipmentImprovementProject
electrochemicalimpedancespectroscopy
extendedKalmanfilter
extremelylowfrequency
enterprisemodel;electromagnetic;electromigration
equipmentmaturityassessment
electromagneticcapability;electromagneticcompatability
electromagneticfield
EMG
EMI
EMMA
EMP
EMR
EMU
EOS
EOT
EP
EPL
EPR
EPROM
EPSS
EPT
EQUIP
EQUIP
ERAM
ERM
ERN
ERP
ERS
ERT
ES
ESC
ESCA
ESD
ESH
ESM
ETAB
ETQR
EUV
eV
EWMA
F
F/I
FA
FAB
FAMOS
FBGA
FC
FCM
FCS
FDC
FDE
FDSOI
Fe
FEC
FEM
FEOL
FESEM
electromigration
electromagneticinterference
electronmicroscopyandmicroanalysis
electromagneticpulse
entermoverequest
electromagneticunit
electricaloverstress
endoftransfer;equivalentoxidethickness
extremepressure;electropolish
electronprojectionlithography
electronparamagneticresonance
electricallyprogrammableread-onlymemory
electronicperformancesupportsystem
equipmentperformancetracking
C/Iequipmentcontrolandintegration
RTCequipmentreal-timecontrol
equipmentreliability
enterprisereferencemodel
externalrecurrentneuralnetwork
extendedrangepyrometer
eventreportingstandard
emergencyresponsetime
engineeringspecification;expertsystem
electrostaticchuck
electronspectroscopyforchemicalanalysis
electrostaticdischarge
environment
electronicservicemanual
ExecutiveTechnicalAdvisoryBoard
ExternalTotalQualityandReliability
extremeultraviolet
electronvolt
exponentiallyweightedmovingaverage
fluorine
finalinspection
failureanalysis
fastatombombardment
floating-gateavalanche-injectionmetal-oxidesemiconductor
fine-pitchballgridarray
flipchip
facilitiescostmodel
factorycontrolsystem
faultdetectionandclassification
frequencydomainexperiments
fullydepletedsilicononinsulator
iron
fabricationevaluationchip
finiteelementmodel
frontendofline
fieldemissionscanningelectronmicroscopy
FET
FFT
FFU
FI
FIB
FID
FIFO
FIMS
FL
FLOPC
FLOTOX
FLRT
FM
FMEA
FMMC
FMVP
FNN
FOCS
FOSB
FOUP
FOV
FOX
FP
FPD
FPGA
FPLA
FPLF
FPLS
FPMS
FPROM
FRACAS
FRAME
FRMB
FSG
FSM
FT
FTA
FTAB
FTIR
FW
FWHM
FZ
Ga
GAC
GC
GCC
GCD
GCMS
GDPP
GDS
field-effecttransistor
fastFouriertransform
filterfanunit
filterabilityindex;factoryintegration
focusedionbeam
flameionizationdetector
first-in
front-openinginterfacemechanicalstandard
fuzzylogic
floatingpointoperationsneededpercycle
floatinggatetunneloxide
factorylayout/relayouttool
foreignmaterial
failuremodeandeffectsanalysis
factorymaterialmovementcomponent
FrameworkMemberValidationProject
feed-forwardneuralnetwork
fiber-opticchemicalsensor
frontopeningshippingbox
frontopeningunifiedpod
fieldofview
fieldoxide
flashpoint
focalplanedeviation;flatpaneldisplay
field-programmablegatearray
field-programmablelogicarray
field-programmablelogicfamily
field-programmablelogicswitch
FactoryPerformanceModelingSoftware
field-programmableread-onlymemory
FailureReporting
FailureRateAnalysisandModeling
fastrampminibatch
fusedsilicaglass
finitestatemachine
finaltest;Fouriertransform
faulttreeanalysis
FocusTechnicalAdvisoryBoard
Fouriertransforminfrared
fullwave
full-widthhalf-maximum
floatzone
gallium
granularactivatedcarbon
gaschromatography;gravimetriccalibrator
genericcellcontroller
gaschromatographydistillation
gaschromatographymassspectroscopy
gasdriveplasmapinch
graphicaldesignsystem;graphicaldesignsoftware
Ge
GEM
GEMVS
GES
GFC
GFCI
GIDL
GILD
GLC
GOI
GPIB
GSCE
GTS
H
HAP
HARI
HAST
HAZCOM
HB
HCI
HCM
HCMOS
HCS
HD
HDL
HDP
HDPE
He
HEM
HEPA
Hf
HF
Hg
HIBS
HiPOx
HLF
HMDS
HMIS
HMMP
HMOS
HOMER
HOPG
HP
HPEM
HPI
HPL
HPLC
HPM
HPV
HRA
germanium
GenericEquipmentModel
GEMverificationsystem
genericequipmentsimulator
gasfiltercorrelation
groundfaultcircuitinterrupter
gate-induceddrainleakage
gasimmersionlaserdoping
gasliquidchromatography
gateoxideintegrity
general-purposeinterfacebus
gassourcecontrolequipment
GEMTestSystem
hydrogen
hazardousairpollutant
highaspectratioinspection
highlyacceleratedstresstesting
HazardCommunicationStandard
horizontalBridgemancrystal
hotcarrierinjection
hollowcathodemagnetron
high-densityCMOS
hot-carriersuppressed
highdensity
hardwaredescriptionlanguage
high-densityplasma
high-densitypolyethylene
helium
high-efficiencymatching
high-efficiencyparticulateair
hafnium
hydrofluoricacid
mercury
heavyionbackscatteringspectrometry
high-pressureoxygen
horizontallaminarflow
hexamethyldisilizane
hazardousmaterialsinventorystatement
hazardousmaterialsmanagementplan
high-performanceMOS;high-densityMOS
hazardousorganicmassemissionrate
highlyorientedpyroliticgraphite
highpurity
HybridPlasmaEquipmentModel
highpressureisolation
high-performancelogic
high-performanceliquidchromatography
hazardousproductionmaterials;high-puritymetal
high-pressurevent
humanreliabilityanalysis
HRR
HRTEM
HSQ
HTO
HTRB
HUPW
HVAC
I
I/O
I2L
I300I
IC
ICAP
ICMS
ICP
ICP-AES
ICP-MS
ICT
IDDQ
IDEAL
IDL
IDLH
IDS
IEA
IEC
IEDF
IERN
IF
IGFET
ILB
ILD
ILS
IM
IMD
IMMA
IMS
In
INCAMS
IPA
IPL
IPT
Ir
IR
IRAS
IRIS
IRN
IRONMAN
IRTC-1
IS
ISC
highramprate
high-resolutiontransmissionelectronmicroscopy
hydrogensilsesquioxane
high-temperatureoxidation
high-temperaturereversebias
hotultrapurewater
heating
iodine
input/output
integratedinjectorlogic
International300mmInitiative
integratedcircuit;InvestmentCouncil;ionchromatography
inductivelycoupledargon-plasmaspectrometry
integratedcircuitmeasurementsystem
inductivelycoupledplasma
inductivelycoupledplasmaatomicemissionspectroscopy
inductivelycoupledplasmamassspectrometry
idealcycletime
directdrainquiescentcurrent
initiating
interfacedefinitionlanguage
immediatelydangeroustolifeorhealth
interactivediagnosticsystem
ionenergyanalysis
infusedemittercoupling
ionenergydistributionfunction
internal-externalrecurrentneuralnetwork
interface
insulated-gatefield-effecttransistor
innerleadbond
interleveldielectric;interlayerdielectric
intracavitylaserspectroscopy
integratedmodel;integratedmetrology
intermetaldielectric
ionmicrophobemassanalysis
ionmobilityspectroscopy
indium
individualcassettemanufacturingsystem
isopropylalcohol
ionprojectionlithography
idealprocesstime
iridium
infrared
infraredreflection-absorptionspectroscopy
imagingofradicalsinteractingwithsurfaces
internalrecurrentneuralnetwork
ImprovingReliabilityofNewMachinesatNight
interconnectreliabilitytestchip-1
informationsystems;interfacespecifications;integratedsystems
IndustrySteeringCouncil
ISEM
ISM
ISMT
ISPM
ISR
ISS
ITRI
ITRS
IVH
IVP
JDP
JEDEC
JESSI
JIC
JIT
JJT
JVD
K
keV
KPA
Kr
kV
La
LAMMA
LAMMS
LC
LCA
LCC
LCL
LDD
LDL
LDP
LDPE
LEC
LEL
LER
LF
LFL
LGQ
Li
LI
LIC
LID
LIFO
LIMA
LIMS
LLCC
LLD
LLNQ
LM
inspection/reviewspecificequipmentmodel
inductorsupermagnetron
InternationalSEMATECH
insituparticlemonitor
insiturinse
ionscatteringspectroscopy
InterconnectionTechnology
InternationalTechnology
interstitialviahole
integratedvacuumprocessing
JointDevelopmentProgram
JointElectronDeviceEngineeringCouncil
JointEuropeanSubmicronSiliconInitiative
JointIndustrialCouncil
just-in-time
Josephsonjunctiontransistor
jetvapordeposition
potassium;thousand
kiloelectronvolt
keyprocessarea
krypton
kilovolt
lanthanum
lasermicro-massanalysis
lasermicro-massspectroscopy
inductance-capacitance;liquidchromatography
lifecycleanalysis
leadedchipcarrier
lowerconfidencelimit
lightlydopeddrain
lowerdetectionlimit
low-densityplasma
low-densitypolyethylene
liquidencapsulatedCzochralskicrystal
lowerexplosivelimit
lineedgeroughness
laminarflow
lowerflammablelimit
linearGaussianquadratic
lithium
laserinterferometry
linearintegratedcircuit
leadlessinverteddevice
lastin
laser-inducedmassanalysis
laser-inducedmassspectrometry
leadlesschipcarrier
lowerlimitofdetection
leastlotsnextqueue
lightmicroscope
LMMA
LOCOS
LOS
LPC
LPCVD
LPD
LPE
LPI
LPP
LRS
LSE
LSHI
LSI
LSM
LTA
LTCVD
LTO
LTPD
LTV
LV
LVDT
LVI
LVS
LWR
LWS
M
MACT
MALDI
MAN
Management
Manufacturing
MAP
Master
MAWP
MB
MBC
MBE
MBPC
MBTC
MCBA
MCBF
MCBI
MCM
MCP
MCS
MCU
MCVD
MDL
MD-MOS
lasermicroprobemassanalysis
localoxidationofsilicon
lossofselectivity
linearpredictivecoding;laserparticlecounter;lowparticleconcentration;liquid-
borneparticlecounter
low-pressurechemicalvapordeposition
lightpointdefect
liquidphaseepitaxy
low-pressureisolation
laser-producedplasma
laserRamanspectroscopy
latexsphereequivalent
large-scalehybridintegration
large-scaleintegration
laserscanningmicroscope
laserthermalanneal
low-temperaturechemicalvapordeposition
low-temperatureoxidation/oxide
lottolerancepercentdefective
localthicknessvariation
latentvariable
linearvoltagedifferentialtransducer
low-voltageinverter
layoutverificationofschematic
linewidthreduction
largewaferstudy
million;mega
maximumachievablecontroltechnology
matrix-assistedlaserdesorptionandionization
metropolitanareanetwork
Standard
andScience
manufacturingautomationprotocol
DeliverablesList
maximumallowableworkingpressure
machinebatch
machinebathcollection
molecularbeamepitaxy
model-basedprocesscontrol
model-basedtemperaturecontrol
meancyclesbetweenassists
meancyclesbetweenfailures
meancyclesbetweeninterrupts
multichipmodule;manufacturingcyclemanagement
mastercontrolprocessor;multichippackage
materialcontrolsystem
microprocessorcontrolunit;mobilecalibrationunit
metalchemicalvapordeposition
minimumdetectionlimit;
multi-drainmetal-oxidesemiconductor
MDQ
MEBS
MEEF
MEMS
MERIE
MES
MESFET
METS
MeV
MFC
MFM
Mg
MG
MHI
MHz
MIC
MID
MIE
MIM
MIS
MLCC
MLL
MLM
MLR
MMC
MMD
MMIC
MMM
MMMS
MMO
MMOS
MMST
Mn
MNOS
MNS
Mo
MO
MOCVD
MOP
MOS
MOS-C
MOSFET
MP
MP-OES
MPRES
MPU
MRP
MRP-II
MS
MSDS
market-drivenquality
mediumenergybackscatteringspectrometry
maskerrorenhancementfactor
microelectromechanicalsystem
magneticallyenhancedreactiveionetching
manufacturingexecutionsystems
metal-semiconductorfield-effecttransistor
MaterialsandEquipmentTradingService
megaelectronvolt
massflowcontroller
massflowmeter
magnesium
manufacturedgoods
materialhazardindex
megahertz
monolithicintegratedcircuit
materialID
magnetronionetching
metal-insulator-metal
metalinsulatorsilicon
multilayerceramiccapacitor
modifylotlocation
multilevelmetal
messagelogreport
ManufacturingMethodsCouncil
MicrolithographicMaskDevelopmentprogram
monolithicmicrowaveintegratedcircuit
materialmovementmanagement
MaterialMovement
multimodeloptimization
modifiedMOS
MicroelectronicsManufacturingScienceandTechnology
manganese
metal-nitride-oxidesemiconductor
metal-nitridesemiconductor
molybdenum
metal-organic
metal-organicchemicalvapordeposition
modifyoperatingprocedures
metal-oxidesemiconductor
metal-oxidesemiconductorcapacitor
metal-oxidesemiconductorfield-effecttransistormpmeltingpoint
massivelyparallel
multipointopticalemissionspectroscopy
modularplasmareactorsimulator
microprocessorunit
materialsrequirementsplanning
manufacturingresourceplanning
massspectrometry;massspectroscopy
MaterialSafetyDataSheet
MSEM
MSG
MSHA
MSI
MSID
MSLD
MSTAB
MTBA
MTBF
MTBFp
MTBI
MTOL
MTS
MTTA
MTTF
MTTR
MV
MVTR
MW
MWBC
MWT
N
Na
NA
NCMS
NCS
NDA
NDE
NDIR
NDP
NDT
NDUV
NEC
NESHAP
NFOM
NGL
Ni
NIL
NIRA
NMOS
NMR
NN
NRE
NTRS
NTU
NVR
O
OBA
OBEM
OBIC
MetrologySpecificEquipmentModel
ManagementSteeringGroup
MineSafetyandHealthAdministration
medium-scaleintegration;manufacturingsupportitem
massspectrometerleaddetector
massspectrometerleakdetector
ManufacturingSystemsTechnicalAdvisoryBoard
meantimebetweenassists
meantimebetweenfailures
mean(productive)timebetweenfailures
meantimebetweeninterrupt;meantimebetweenincident
meantimeoffline;meantimeonline
MaterialTrackingStandard
meantimetoassist
meantimetofailure
meantimetorepair
megavolt
moisturevaportransmissionrate
molecularweight
meanwafersbetweencleans
monitorwaferturner
nitrogen
sodium
numericalaperture
NationalCenterfor
NetworkCommunicationStandard
nondisclosureagreement
nondestructiveevaluation
nondispersiveinfraredspectroscopy
neutrondepthprofiling
nondestructivetesting
nondispersiveultravioletspectroscopy
NationalElectricCode
NationalEmissionsStandardsforHazardousAirPollutants
near-fieldopticalmicroscopy
next-generationlithography
nickel
nanoimprintlithography
near-infraredreflectionanalysis
negativechannelmetal-oxidesemiconductor
nuclearmagneticresonance
neuralnetwork
nonrecurringengineering
NationalTechnologyRoadmapforSemiconductors
nephelometricturbidityunit
non-volatileresidue
oxygen
objectbehavioranalysis
Object-BasedEquipmentModel
opticalbeam-inducedcurrent
OBL
OC
OCR
OD
ODS
OEE
OEM
OES
OHT
OHV
OL
OLB
OLE
OM
OMA
OMS
OMT
OO
OOA
OOD
OODB
OODBMS
OOP
OPC
OS
OSD
OSF
OSG
OSI
OSRM
OSS
Ox
P
P/T
PAB
PAC
PACVD
PA-FTIR
PAG
PAL
PAM
PAS
PAWS
Pb
PBET
PBGA
PBL
PBS
PC
PCAD
object-basedlanguage
opencassette
opticalcharacterrecognition
outsidediameter
ozone-depletingsubstances
overallequipmenteffectiveness
originalequipmentmanufacturer
opticalemissionspectroscopy
overheadtransport;overheadhoisttransport
overheadvehicle
overlay
outerleadbond
objectlinkingandembedding
operationalmodeling;opticalmicroscopy
objectmanagementarchitecture
opticalmassspectroscopy
objectmodelingtechnique
object-oriented
object-orientedanalysis
object-orienteddesign
object-orienteddatabase
object-orienteddatabasemanagementsystem
object-orientedprogramming
opticalparticlecounter;opticalproximitycorrection
operatingsystem
organicspin-ondielectric
OpenSystemsFoundation
organosilicateglass
opensysteminterconnection
OfficeofStandardReferenceMaterials
ObjectServicesStandard
oxide
phosphorous
precision-tolerance
post-applybake
photoactivecompound
plasma-assistedchemicalvapordeposition
photoacousticFouriertransforminfraredspectroscopy
photoacidgenerator
processautomationlanguage;programmablearraylogic;processassetlibrary
processapplicationmodule
photoacousticspectroscopy
portableacousticwavesensor
lead
Performance-BasedEquipmentTraining
plasticballgridarray
poly-bufferedLOCOS
photonbackscattering
personalcomputer;programmablecontroller;processcontrol
packagingcomputer-aideddesign
PCB
PCMP
PCMS
PCO
PCR
PCT
Pd
PDC
PDSOI
PDU
PDVC
PEB
PECVD
PED
PEDS
PEELS
PEL
PES
PET
PETEOS
PFA
PFC
PFPE
PGA
P-GILD
PGV
PI
PID
PIII
PIND
PIP
PIV
PLA
PLC
PLCC
PLL
PLS
PLY
PM
PMC
PMCC
PMI
PMMA
PMOS
PMS
PMT
PMTF
POR
POU
printedcircuitboard
post-chemicalmechanicalpolishing
plasmachemistryMonte-Carlosimulation
photocatalyticoxidation
principlecomponentregression
processchangeteam
palladium
passivedatacollection
portabledocumentformat
partiallydepletedsilicononinsulator
protocoldataunit
phase-dependentvoltagecontrast
post-exposurebake
plasma-enhancedchemicalvapordeposition
post-exposuredelay
plasma-enhanceddepositionsystem
parallelelectronenergylossspectrometry
permissibleexposurelevel
photoelectronspectroscopy
post-etchtreatment
plasma-enhancedtetraethylorthosilicate
perfluoroalkoxy
perfluorocarbon
perfluorinatedpolyether
pingridarray
projectiongasimmersionlaserdoping
person-guidedvehicle
proportionalintegral
proportionalintegralderivative;process-induceddefect
plasmaimmersionionimplantation
particleimpactnoisedetection
process-inducedparticle
peakinversevoltage;postindicatorvalve
programmablelogicarray
programmablelogiccontroller
plasticleadedchipcarrier
plasmalockload
partialleastsquares;projectionoflatentstructures
photolimitedyield
processmonitor;preventivemaintenance;processmodule
processmodulecontroller
Pensky-Martensclosedcup
phasemeasuringinterferometer
polymethylmethacrylate
positivechannelmetal-oxidesemiconductor
particlemeasuringsystem
photomultipliertube
ProductManagementTaskForce
process-of-record
point-of-use
POUCG
PPE
PPGA
PPID
PQFP
PRAS
PRB
PRBS
PROM
PRSC
PRV
PS
PSB
PSC
PSD
PSG
PSII
PSL
PSLS
PSM
Pt
PTAB
PTC
PTFE
PVA
PVC
PVD
PVDF
PWB
PWP
QA
QC
QCM
QDR
QFD
QFP
QMS
QSR
QTAT
R2R
Ra
RAC
RAIRS
RAM
RAMP
Rb
RBB
RBS
RCWA
RDR
point-of-usechemicalgeneration
personalprotectiveequipment
plasticpingridarray
processprogramidentification
plasticquadflatpack
particlereactoranalysisservices
pseudo-randombinary
pseudo-randombinarysequence
programmableread-onlymemory
parametricresponsesurfacecontrol
personrailguidedvehicle
poroussilicon
phase-shiftingblank
poroussiliconcapacitor
powerspectraldensity;portstatusdisplay
phosphosilicateglass
plasmasourceionimplantation
polystyrenelatex
polystyrenelatexsphere
phase-shiftmask
platinum
ProjectTechnicalAdvisoryBoard
pre-andpost-processtreatmentchambers
polytetrafluorethylene
polyvinylacetate
polyvinylchloride
physicalvapordeposition
polyvinylidenefluoride
printedwiringboard
particlesperwaferpass
qualityassurance
qualitycontrol
quartzcrystalmicrobalances
quickdumprinse
qualityfunctiondeployment
quadflatpackage
quadrupolemassspectrometry
qualitysystemreview
quickturnaroundtime
run-to-run
radium
remoteaccessandcontrol
reflection-absorptioninfraredspectroscopy
randomaccessmemory;reliability
ReliabilityAnalysisandModelingProgram
rubidium
basesheetresistance
refractivebackscattering;Rutherfordbackscatteringspectroscopy
rigorouscoupledwaveanalysis
rotatingdiskreactor
Re
REL
Research
RESSFOX
RF
RFI
RFM
RFO
RFP
RGA
RGV
RH
RI
RIE
RISC
RIST
RMOS
RMS
RMTF
RNN
RO
Roadmap
ROC
ROE
ROI
ROM
RPAO
RR
RRMSEP
RSE
RSF
RSM
RT
RTA
RTB
RTCVD
RTD
RTL
RTM
RTO
RTP
RTR
Ru
S
S/D
S/N
SA
SAM
SAT
SAW
rhenium
recommendedexposurelimit
Institute
recessedsealedsidewallfieldoxidation
radiofrequency;resonancefrequency
requestforinformation;radiofrequencyinterference
radiofrequencymonitoring
restrictedfloworifice
requestforplan;requestforproposal;radiofrequencyprobe
residualgasanalysis
rail-guidedvehicle
relativehumidity
reliabilityimprovement
reactiveionetch
reducedinstructionsetcomputer/computing
ruleinductionandstatisticaltesting
refractorymetal-oxidesemiconductor
rootmeansquare;RecipeManagementStandard
RecipeManagementTaskForce
recurrentneuralnetwork
reverseosmosis
forSemiconductors
remoteobjectcommunications
returnonequity
returnoninvestment
read-onlymemory
remoteplasma-assistedoxidation
removalrate
relativerootmeansquareerrorofprediction
reactivesputteretch
relativesensitivityfactor
responsesurfacemethodology;responsesurfacematrix
roomtemperature
rapidthermalanneal
real-timebackplane
rapidthermalchemicalvapordeposition
resistancetemperaturedetector
resistor-transistorlogic;registertransferlevel
rapidthermalmultiprocessing
rapidthermaloxidation;regenerativethermaloxidizer
rapidthermalprocessing/processor
real-timereporting
ruthenium
sulfur
source/drain
signal-to-noise
surfacearea;subresolutionassist;structuredanalysis
scanningaugermicroscopy
sprayacidtool
surfaceacousticwave
Sb
SB
SC1
SC2
SCA
SCALE
SCALPEL
SCC
SCCS
SCE
SCF
SCI
SCM
SCOE
SCP
SCR
SD
SDFL
Se
SE
SEAJ
SEC
SECS
SEG
SEIM
SEM
SEMI
SFC
SFCS
SFCS
SGMRS
Si
SIA
SIDP
SIMO
SIMOX
SIMS
SiP
SISO
SL
SLAM
SLC
SM
SMB
SMC
SME
SMIF
SMPM
SMS
SMTS
antimony
strongbaseionexchange
StandardClean1
StandardClean2
surfacechargeanalysis
SEMATECHCellApplicationLearningEnvironment
scatteringwithaperturelimitedprojectionlithography
strategiccellcontroller
sourcecodecontrolsystem
shortchanneleffects
supercriticalfluid
surfacechargeimaging
scanningcapacitancemicroscopy
SEMATECHCenterofExcellence
single-chippackage
silicon-controlledrectifier
smalldualin-linepackage;structureddesign
Schottky-diodeFETlogic
selenium
spectroscopicellipsometry;secondaryelectron
SemiconductorEquipmentAssociationofJapan
sizeexclusionchromatography
SemiconductorEquipmentCommunicationsStandard
selectiveepitaxialgrowth
softwareengineeringimprovementmethod
scanningelectronmicroscopy;specificequipmentmodel
SemiconductorEquipmentandMaterialsInternational
supercriticalfluidchromatography
shopfloorcontrolsystem
I/Fshopfloorcontrolsysteminterface
SemiconductorGenericManufacturingRequirementsSpecification
silicon
SemiconductorIndustryAssociation
sputteriondepthprofiling
singleinput
separationbyimplantationofoxygen
secondaryionmassspectroscopy
system-in-a-package
singleinput
specificationlimit
scanninglaseracousticmicroscopy;single-layeraluminummetallization
surfacelaminarcircuit
stressmigration
single-maskbumping
surface-mountedcomponent
subjectmatterexpert;softwaremaintenanceengineer
standardmechanicalinterface
SECSmessageprotocolmachine
SECSmessageservice
StrategicMaterialTransportSystem
Sn
SNMS
SNOM
SNR
SO
SoC
SOD
SODAS
SOG
SOI
SOIC
SOM
SoP
SOP
SOS
SPC
SPICE
SPIDER
SPIDER-MEM
SPIN
SPM
SPP
SPR
SPV
SQC
SQPMM
Sr
SRAM
SRC
SRP
SRS
SSA
SSE
SSEM
SSI
SSM
sSOI
SSQA
SSRL
SSRP
STAR
STEL
STEM
STI
STM
STP
SU
SWEAT
SWI
SWIM
tin
sputteredneutralmassspectroscopy
scanningnear-fieldopticalmicroscopy
signal-to-noiseratio
smalloutline(package)
system-on-a-chip
spin-ondielectric
SEMATECHOrganizedDamageAnalysisSoftware
spin-onglass
silicononinsulator
smalloutlineintegratedcircuit
scanningopticalmicroscopy;sulfuricacid-ozonemixture
system-on-a-package
standardoperatingprocedure
silicononsapphire
statisticalprocesscontrol
simulationprogramwithintegratedcircuitemphasis
SEMATECHProcessInducedDamageEffectRevealer
SPIDER-ManufacturingEquipmentMonitor
SoftwareProcessImprovementNetwork
scanningprobemicroscopy
single-phaseprinting
semiconductorprocessrepresentation
surfacephotovoltage
statisticalqualitycontrol
SoftwareQualityandProcessMaturityModel
strontium
staticrandomaccessmemory
SemiconductorResearchCorp.
spreadingresistanceprobe
softwarerequirementsspecification
SemiconductorSafetyAssociation;spatialsignatureanalysis
sumsquarederror
StepperSpecificEquipmentModel
small-scaleintegration
strategicsourcingmethodology
strainedsilicononinsulator
StandardizedSupplierQualityAssessment
SEMATECHSoftwareReuseLibrary
SEMATECHSoftwareReuseProgram
simultaneoustransmittedandreflected
short-termexposurelimit
scanningtransmissionelectronmicroscopy
shallowtrenchisolation
scanningtunnelingmicroscopy
standardtemperatureandpressure;systemtestplan
subresolutionattenuated
standardwafer-levelelectromigrationacceleratedtest
staticwalkthrough/inspection
SemiconductorWorkbenchforIntegratedModeling
SWP
SWR
SWV
T/C
Ta
TAB
TAP
TAS
TASC
TAT
TBAH
TC
TCA
TCAD
TCC
TCE
TCM
TCP
TCP/IP
TCR
TD
TDDB
TDEAT
TDLAS
TDMAT
TDMS
TDS
Te
TE
TEA
TEC
TECAP
TED
TEG
TEM
TEOS
TFC
TFE
TFT
TG
TGA
THC
Ti
TIBA
TIR
TIS
Tl
TLC
TLE
TLI
single-waferprocessing
semiconductorwaferrepresentation
squarewavevoltammetry
thermocompression
tantalum
TechnicalAdvisoryBoard;tapeautomatedbonding
ToolApplicationProgram
traceanalysissystem
TechnicalAnalysisServiceforCoO
turnaroundtime
tetrabutylammoniumhydroxide
timeconstant;temperaturecoefficient;thermocouple
testcalibrationassembly;1
technologycomputer-aideddesign
tacticalcellcontroller
temperaturecoefficientofexpansion
tunnelingcurrentmicroscopy
transformer-coupledplasma;tapecarrierpackage
transmissioncontrolprotocol/Internetprotocol
temperaturecoefficientofresistance
thermaldesorption
time-dependentdielectricbreakdown
tetrakis(diethylamino)titanium
tunablediodelaserabsorptionspectroscopy
tetrakis(dimethylamido)titanium
thermaldesorptionmassspectrometry
thermaldesorptionspectroscopy
tellurium
transverseelectric;transmittedelectron
transverseexcitedatmosphere
thermalexpansioncoefficient;testandelectricalcharacterization
transistorelectricalcharacterizationandanalysisprogram
transientenhanceddiffusion;transmittedelectrondetection
technicalexchangegroup
transmissionelectronmicroscopy;transverseelectromagnetic
tetraethylorthosilicate;tetrethoxysilicide
totalfaultcoverage
tetrafluorethylene
thin-filmtransistor
thermogravimetry
thermalgasanalysis;thermalgravimetricanalysis
totalhydrocarbons
titanium
triisobutlaluminum
totalindicatorrunout;totalinternalreflection
tool-inducedshift
thallium
thinlayerchromatography
toolloadingelevator
thinlayerimaging
TLM
TLV
TLV/TWA
TM
TMA
TMB
TMC
TMP
TO
TOA
TOC
TOF
TPD
TPG
TPM
TPRS
TPU
TQM
TSCA
TSI
TSOP
TSP
TT
TTL
TTV
TVS
TWA
TWG
TXRF
U
UBM
UCL
UF
UHF
UHP
UHV
UID
ULA
ULK
ULPA
ULSI
UPW
USART
USOP
Utt
UV
V
VAC
VAR
VASE
tape-layingmachine;telemeter;transitionlinemodel
thresholdlimitvalue
thresholdlimitvalue/time-weightedaverage
transportmodule
thermalmechanicalanalyzer
trimethylborate
transportmodulecontroller;transfermodulecontroller
trimethylphosphate;turbomolecularpump
transistoroutlinepackage
take-offangle
totalorganiccarbon;totaloxidizablecarbon
time-of-flight
temperatureprogramdesorption
testpatterngeneration
totalproductivemaintenance;totalproductivemanufacturing
temperatureprogrammedreactionspectroscopy
thermalprocessingunit
totalqualitymanagement
ToxicSubstancesControlAct
topsurfaceimaging
thinsmalloutlinepackage
temperature-sensitiveparameter
technologytransfer
transistor-transistorlogic
totalthicknessvariation
triangularvoltagesweep
time-weightedaverage
TechnicalWorkingGroup
totalX-rayfluorescence
uranium
under-bumpmetallurgy
upperconfidencelimit;uppercontrollimit
ultra-filtration
ultrahighfrequency
ultrahighpurity
ultrahighvacuum
useridentification
uncommittedlogicarray
ultralow-k
ultralowparticulateair
ultralarge-scaleintegrationuphunitsperhour
ultrapurewater
universalsynchronous/asynchronousreceiver/transmitter
ultrasmalloutlinepackage
unattenuated
ultraviolet
vanadium;volt
voltsalternatingcurrent
value-addedreseller;volt-amperereactive
variableanglespectroscopicellipsometry
VDC
VDP
VDS
VHF
VLE
VLF
VLSI
VME
V-MOS
VOC
VPD
VPD-ICPMS
VTP
VTVM
VUV
W
W/B
WAN
WB
WBS
WBSEM
WDS
WDX
WDXA
WEC
WFT
WIB
WIP
WIW
WIWNU
WLBI
WLP
WLT
WNP
WPC
wph
WSI
WTC
WTW
WTWNU
X
XANES
Xe
XLS
XPS
XRD
XRF
Y
YAG
Z
voltsdirectcurrent
VanderPauw
vapordistributionsystem
veryhighfrequency
vaporlevitationepitaxy
verticallaminarflow
verylarge-scaleintegration
versamicromoduleextension;virtualmanufacturingenterprise
v-groovemetal-oxidesemiconductor
volatileorganiccompound
vaporphasedesorption;vaporphasedecomposition
vaporphasedecomposition-inductivelycoupledplasmamassspectroscopy
verticalthermalprocessor
vacuumtubevoltmeter
vacuumultraviolet
tungsten
wirebonding
wideareanetwork
weakbase
workbreakdownstructure
WireBonderSpecificEquipmentModel
wavelength-dispersivespectrometryofX-rays
wavelength-dispersiveX-ray
wavelength-dispersiveX-rayanalysis
waferenvironmentcontrol
waferfabricationtemplate
within-batch
workinprocess;workinprogress
within-wafer
within-wafernon-uniformity
wafer-levelburn-in
wafer-levelpackage
wafer-leveltest
wasteneutralizationplant
waferprocesschamber
wafersperhour
wafer-scaleintegration
wafertransferchamber
wafertowafer
wafer-to-wafernon-uniformity
inductivereactance
X-rayadsorptionnearedgestructurespectroscopy
xenon
excimerlasersystem;extendedlightscatterer
X-rayphotoelectronspectroscopy
X-raydiffraction
X-rayfluorescencespectrometry
yttrium
yttriumaluminumgarnet
zinc
Zr zirconium
发布评论