2024年4月2日发(作者：)

不 良 分 类

A01

A02

A03

A04

A05

A06

A07

A08

A09

A10

A11

A12

A13

A14

A15

A16

A17

A18

A19

A20

A21

A22

B01

B02

B03

B04

B05

B06

B07

B08

B09

B10

B11

B12

B13

B14

B15

B16

B17

B18

B19

B20

B21

B22

B23

B24

B25

B26

C01

C02

C03

C04

C05

C06

C07

C08

C09

C10

C11

C12

C13

C14

C15

芯片划伤

芯片沾污

暴边

压焊块变色

墨点不良

保护膜不良

针迹异常

芯片裂纹

背面缺损

铝线异常

掉芯片

划槽宽度异常

芯片厚度异常

切割深度异常

划偏

方向异常

芯片缺角

擦伤

墨水沾污

管座划伤

管座有胶

桥下异物

芯片压伤

芯片异物附着

芯片顶针印迹

墨点芯片

装片胶沾润性

装片胶沾污

装片胶异常

装片胶潮解

装片胶分层

装片胶厚度BLT

装片倾斜Tilt

装片胶空洞Voids

芯片位置

框架变形

框架氧化

框架镀层异常

下陷

装片胶溢出

双芯片

漏银

边缘芯片

无压模

框架划伤

装片胶化水

胶扩散

无芯片

塑封偏位

塑封反

塑封体缺损

未填充

溢料

浇口残留

针孔

金丝露出

压痕

塑封粘模

塑封体凹陷

塑封体龟裂/裂纹

塑封体划伤

塑封压筋

塑封体疏松

Die scratched

Die contamination

Die frank chipout

BP0 discoloration

ink NG

Protect tape NG

tip remains abnormal

Die crack

backside chipping

wire abnormal

Missing die

street width abnormal

Die thickness abnormal

cutting depth abnormal

cutting orientation offset

orientation abnormal

Die Corner chipped

scratch

ink dirt

foreign material

Die ejector pin mark

Ink chip

glue coverage/adhesive wetting

adhesive contamination

adhesive abnormal

adhesive deliquesce

adhesive delamination

BLT

Tilt

Voids

Die location

L/F distorted

L/F oxidated

L/F plating abnormal

Pitting

glue bleed

double chips

Ag leaked

Edge chip/fringe chip

spanker NG

L/F scratched

glue scattered

Chip NG

Offset molding

Reverse molding

PKG chipping

incomplete fill

flash/resin bleed

Gate residue

pin hole

Exposed of Au wire

Indentation

Sticking

PKG ruggedness/PKG pitted

PKG gap

PKG scratched

porous surface

C16

C17

C18

C19

C20

C21

C22

C23

C24

C25

C26

C27

C28

C29

C30

C31

D01

D02

F11

F12

F13

F14

F15

I1

I2

I3

I4

I5

I6

I7

I8

I9

I10

I11

I12

I13

I14

I15

I16

I17

I18

I19

I20

I21

I22

I23

I24

I25

I26

I27

I28

M01

M02

M03

M04

M05

M06

M07

M08

M09

M10

M11

P01

P02

P03

第一焊点断丝

第二焊点断丝

金丝变形

内引线变形

金球剥离

金丝残留

白板

内部气泡

空洞

金丝变形率

金丝投影重叠

塑封跑料

顶杆缺损

顶杆深度超标

塑封体花斑

飞边皮

卡框架

掉产品

混批

歪头

覆盖膜剥离

覆盖膜偏位

编带异常

针迹偏

针迹大

无针迹/无墨点

沾污

划伤

压点变色

批号不符

片号不符

裂纹

碎片

良品数数量不符

片数不符

无保护膜

保护膜缺损

铝缺损

配线不符

确认文字不符

品名不符

背面花斑

圆片背面沾污

压点异常

有针迹无墨点

墨点偏

墨点高

金属化不符

爆边

划偏

厚度超标

偏印

无印

印章倒置

反印

断字

字体不清

油墨沾污

印记过深

印重叠

印章倾斜

印打错

镀层鼓泡

镀层剥离

基体露出

1st wire broken

2nd wire broken

wire sweep

inner down-lead sweep

Ball shear

Au wire residue

No die/Missing die

void inside

void

wire sweep rate

wire projection overlap

flash

ejector pin chipping

ejector pin depth beyond spec.

PKG skewbald

Flash

L/F stocked

fall

mixed products

L/F distort

Cover tape peeling

Offset sealing/Cover tape off-center

Reel abnormal

tip remains offset

tip remains size beyond spec.

No tip remains/No ink dot

contamination/dirt/stain

scratch

Pad discoloration

Lot hed

Piece hed

crack

scrap

Good ones quantity unmatched

Piece quantity unmatched

No protect tape

Tape chipout

Al chipping

Inconsistent bonding diagram

Text unmatched

Inconsistent device description

Backside skewbald

wafer backside stain/dirt

Pad abnormal

tip remains but no ink dot

ink offset

ink dot height beyond spec.

Die frank chipout

cutting orientation offset

Thickness beyond spec.

Stamp misalignment

mark NG

Stamp inversion/Stamp inversed

mark reverse

Symbolization broken

Symbolization illegible

ink dirt

Marking depth beyond spec.

Marking overlap

Marking inclination

Wrong marking

plating blister/blister on the plated surface

plating peeling/peeling on the plated surface

base exposure/Die exposure/Exposed base material

P04

P05

P06

P07

P08

P09

Q11

Q12

Q13

Q14

Q15

Q16

Q17

Q18

Q19

Q110

Q111

Q112

Q199

Q31

Q32

Q33

Q34

T01

T02

T04

T05

T07

T08

T10

T12

T13

T14

T16

T17

T18

V01

V02

V03

V04

V05

V06

V07

V08

V09

V10

镀层粗糙

镀层沾污

厚度和成份超标

镀层渣附着

易焊性不良

引线变细/变粗

芯片方向

L/F上胶附着

2ND形状

2ND偏

2ND异物压着

2ND剥离

重焊

无配线

配线错误

混料

丝残留

压焊块异常

其他

异品种混入

方向反

取样

树脂残留

引线打痕

连筋

异物附着

塑封体裂纹

偏筋

断脚

冲反

塑封体沾污

引线沾污

引线划伤

脚尖毛刺

引线变形

卡滞废

金属毛刺

纷失

散热片溢料

散热片沾污

散热片打痕

塑封体平行度不良

引线脚开裂

铜粉附着

散热片倾斜

散热片划伤

装片胶沾润率

异物沾污

第一焊点偏

芯片缺角

焊料沾污

芯片位置

第一焊点剥离

芯片焊不上

方向反

plating roughness/rough plating

plating dirt

Thickness and composition Beyond specification

plating residue adhesion

Solderability NG

Die orientation

glue adhesion on the L/F

2nd bond shape

2nd bond offset

foreign on the 2nd bond

2nd bond Peeling

Rebond

No bonding diagram

Bonding diagram NG

mixed materials

wire residue

BPO abnormal

Others

Heterogeneous

orientation reserved/misoriented

Sample

resin residue

lead dent

Tiebar residue

foreign

PKG gap

Trim NG/Trim off-center

Missing/broken lead

PKG dirt

lead dirt

lead scratch

burr

lead distort

Jam

material burrs

heatsink flash

heatsink dirt

heatsink dent

PKG warpage NG

Cracked lead

copper adheresion

heatsink tilt

heat sink scratch

Solder coverage

Broken/crack package

foreign material (adhesion)

Solder bump

1st bond offset

deformed lead/reverse forming

Die corner chipping

Exposed base material on slug

Solder contamination

Dambar residue

Die location offset

lead crush

1st bond peeling

shorted lead

Die attach NG

Lead misalignment

Orientation reversed

W01

W02

W03

W04

W05

W06

W07

W08

W09

W10

W11

W12

W13

W14

W15

W16

W17

W18

W19

W20

W21

W22

W23

1ST偏

1ST剥离

1ST球形异常

1ST颈断

2ND断丝

弧形不良

焊丝划伤缺损

尾丝长度

打洞

漏焊

压焊块窗口未开

芯片焊不上

卡带

钢嘴打芯片

钩子钩芯片

试验

双丝

2ND剥离

桥损伤

焊点不完整

虚焊

焊点变形不良

压爪打芯片

1st bond offset

1st bond peeling

1st ball abnormal

1st neck break

2nd wire broken

Loop NG

tail length

top metal peeling

BPO unopened

Attach NG/Bond NG/NSOP

Jam

wedge tool contact die surface

hook contact die surface

test

double wires

2nd bond peeling;NSOL

bridge scathe

bond incomplete

bond NG

bond distort

clamp contact die surface