2024年4月3日发(作者：)

专利内容由知识产权出版社提供

专利名称：ADHESION PROMOTION OF METAL TO

LAMINATE WITH A MULTI-FUNCTIONAL

COMPOUND

发明人：ABYS, Joseph, A.,ANTONELLIS,

Theodore,SUN, Shenliang,WALCH, Eric,OWEI,

Abayomi I.,RASMUSSEN, Jean

申请号：EP09723171.6

申请日：20090323

公开号：EP2274460B1

公开日：20121010

摘要：An adhesion promotion composition and method for enhancing adhesion

between a copper conducting layer and a dielectric material during manufacture of a

printed circuit board. The adhesion promotion composition comprises a multi-functional

compound comprising a first functional group and a second functional group, wherein the

first functional group is an aromatic heterocyclic compound comprising nitrogen and the

second functional group is selected from the group consisting of vinyl ether, amide,

thiamide, amine, carboxylic acid, ester, alcohol, silane, alkoxy silane, and combinations

thereof.

申请人：ENTHONE

地址：US

国籍：US

代理机构：UEXKÜLL & STOLBERG

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