2024年4月19日发(作者：)

PCB线路板工艺流程及中英文对照 (2009/04/08

13:56)

目录： 公司动态

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流程简介：开料－－钻孔－－干膜制程－－压合－－减铜－－电镀－－塞

孔－－防焊

－－镀金－－喷锡－－成型－－开短路测试－－终检－－雷射钻孔

A.

开料

( Cut Lamination)

a-1

裁板

( Sheets Cutting)

a-2

原物料发料

(Panel)(Shear material to Size)

B.

钻孔

(Drilling)

b-1

内钻

(Inner Layer Drilling )

b-2

一次孔

(Outer Layer Drilling )

b-3

二次孔

(2nd Drilling)

b-4

雷射钻孔

(Laser Drilling )(Laser Ablation )

b-5

盲

(

埋

)

孔钻孔

(Blind & Buried Hole Drilling)

C.

干膜制程

( Photo Process(D/F))

c-1

前处理

(Pretreatment)

c-2

压膜

(Dry Film Lamination)

c-3

曝光

(Exposure)

c-4

显影

(Developing)

c-5

蚀铜

(Etching)

c-6

去膜

(Stripping)

c-7

初检

( Touch-up)

c-8

化学前处理

,

化学研磨

( Chemical Milling )

c-9

选择性浸金压膜

(Selective Gold Dry Film Lamination)

c-10

显影

(Developing )

c-11

去膜

(Stripping )

Developing , Etching & Stripping ( DES )

D.

压合

Lamination

d-1

黑化

(Black Oxide Treatment)

d-2

微蚀

(Microetching)

d-3

铆钉组合

(eyelet )

d-4

叠板

(Lay up)

d-5

压合

(Lamination)

d-6

后处理

(Post Treatment)

d-7

黑氧化

( Black Oxide Removal )

d-8

铣靶

(spot face)

d-9

去溢胶

(resin flush removal)

E.

减铜

(Copper Reduction)

e-1

薄化铜

(Copper Reduction)

F.

电镀

(Horizontal Electrolytic Plating)

(

绿漆

/

绿油

)

f-1

水平电镀

(Horizontal Electro-Plating) (Panel Plating)

f-2

锡铅电镀

( Tin-Lead Plating ) (Pattern Plating)

f-3

低于

1 mil ( Less than 1 mil Thickness )

f-4

高于

1 mil ( More than 1 mil Thickness)

f-5

砂带研磨

(Belt Sanding)

f-6

剥锡铅

( Tin-Lead Stripping)

f-7

微切片

( Microsection)

G.

塞孔

(Plug Hole)

g-1

印刷

( Ink Print )

g-2

预烤

(Precure)

g-3

表面刷磨

(Scrub)

g-4

后烘烤

(Postcure)

H.

防焊

(

绿漆

/

绿油

): (Solder Mask)

h-1 C

面印刷

(Printing Top Side)

h-2 S

面印刷

(Printing Bottom Side)

h-3

静电喷涂

(Spray Coating)

h-4

前处理

(Pretreatment)

h-5

预烤

(Precure)

h-6

曝光

(Exposure)

h-7

显影

(Develop)

h-8

后烘烤

(Postcure)

h-9 UV

烘烤

(UV Cure)

h-10

文字印刷

( Printing of Legend )

h-11

喷砂

( Pumice)(Wet Blasting)

h-12

印可剥离防焊

(Peelable Solder Mask)

I .

镀金

Gold plating

i-1

金手指镀镍金

( Gold Finger )

i-2

电镀软金

(Soft Ni/Au Plating)

i-3

浸镍金

( Immersion Ni/Au) (Electroless Ni/Au)

J.

喷锡

(Hot Air Solder Leveling)

j-1

水平喷锡

(Horizontal Hot Air Solder Leveling)

j-2

垂直喷锡

( Vertical Hot Air Solder Leveling)

j-3

超级焊锡

(Super Solder )

j-4.

印焊锡突点

(Solder Bump)

K.

成型

(Profile)(Form)

k-1

捞型

(N/C Routing ) (Milling)

k-2

模具冲

(Punch)

k-3

板面清洗烘烤

(Cleaning & Backing)

k-4 V

型槽

( V-Cut)(V-Scoring)

k-5

金手指斜边

( Beveling of G/F)

L.

开短路测试

(Electrical Testing) (Continuity & Insulation Testing)

l-1 AOI

光学检查

( AOI Inspection)

l-2 VRS

目检

(Verified & Repaired)

l-3

泛用型治具测试

(Universal Tester)