2024年4月19日发(作者：)

SN74AUP1G97

S505J–NOVEMBER2003–REVISEDMAY2010

LOW-POWERCONFIGURABLEMULTIPLE-FUNCTIONGATE

CheckforSamples:SN74AUP1G97

FEATURES

AvailableintheTexasInstrumentsNanoStar™

Package

LowStatic-PowerConsumption

(I

CC

=0.9mAMax)

LowDynamic-PowerConsumption

(C

pd

=4.8pFTypat3.3V)

LowInputCapacitance(C

I

=1.5pFTyp)

LowNoise–OvershootandUndershoot

<10%ofV

CC

I

off

SupportsPartial-Power-DownMode

Operation

IncludesSchmitt-TriggerInputs

•

•

•

•

•

•

•

WideOperatingV

CC

Rangeof0.8Vto3.6V

Optimizedfor3.3-VOperation

3.6-VI/OToleranttoSupportMixed-Mode

SignalOperation

t

pd

=5.6nsMaxat3.3V

SuitableforPoint-to-PointApplications

Latch-UpPerformanceExceeds100mAPer

JESD78,ClassII

ESDPerformanceTestedPerJESD22

–2000-VHuman-BodyModel

(A114-B,ClassII)

–1000-VCharged-DeviceModel(C101)

DRL PACKAGE

(TOPVIEW)

•

•

•

•

•

•

•

DBV PACKAGE

(TOPVIEW)

DCK PACKAGE

(TOPVIEW)

B

GND

A

1

2

3

6

5

4

C

V

CC

Y

B

GND

A

1

2

3

6

5

4

C

V

CC

Y

B

GND

A

1

2

3

6

5

4

C

V

CC

Y

DRY PACKAGE

(TOPVIEW)

DSF PACKAGE

(TOPVIEW)

YFP PACKAGE

(TOPVIEW)

YZP PACKAGE

(TOPVIEW)

B

GND

1

2

3

6

C

V

CC

Y

B

GND

A

1

2

3

6

5

4

C

V

CC

Y

5

4

A

B

GND

A

A1

B1

C1

1

2

3

6

A2

5

B2

4

C2

C

V

CC

Y

B

GND

A

A1

B1

C1

1

2

3

6

A2

5

B2

4

C2

C

V

CC

Y

See mechanical drawings for dimensions.

DESCRIPTION/ORDERINGINFORMATION

TheAUPfamilyisTI'spremiersolutiontotheindustry'slow-powerneedsinbattery-poweredportable

milyensuresaverylowstatic-anddynamic-powerconsumptionacrosstheentireV

CC

range

of0.8Vto3.6V,resultinginincreasedbatterylife(seeFigure1).Thisproductalsomaintainsexcellentsignal

integrity(seetheverylowundershootandovershootcharacteristicsshowninFigure2).

Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas

Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.

PRODUCTIONDATAinformationiscurrentasofpublicationdate.

ProductsconformtospecificationsperthetermsoftheTexas

tionprocessingdoesnot

necessarilyincludetestingofallparameters.

Copyright©2003–2010,TexasInstrumentsIncorporated

SN74AUP1G97

SCES505J–NOVEMBER2003–REVISEDMAY2010

Static-Power Consumption

(µA)

100%

80%

60%

40%

20%

0%

†

Switching Characteristics

at 25 MHz

†

3.5

3

V

o

l

t

a

g

e

−

V

2.5

2

1.5

1

0.5

0

−0.5

AUP

†

Dynamic-Power Consumption

(pF)

100%

80%

InputOutput

3.3-V

Logic

†

60%

40%

20%

AUP

3.3-V

Logic

†

LVC

05

1015

0%

20

25

30

Time − ns

354045

Single, dual, and triple gates

AUP1G08 data at C

L

= 15 pF

–entSignalIntegrity

putstateisdeterminedbyeightpatternsof

rcanchoosethelogicfunctionsMUX,AND,OR,NAND,NOR,inverter,

inputscanbeconnectedtoV

CC

orGND.

ThedevicefunctionsasanindependentgatewithSchmitt-triggerinputs,whichallowsforslowinputtransition

andbetterswitching-noiseimmunityattheinput.

NanoStar™packagetechnologyisamajorbreakthroughinICpackagingconcepts,usingthedieasthe

package.

Thisdeviceisfullyspecifiedforpartial-power-downapplicationsusingI

off

.TheI

off

circuitrydisablestheoutputs,

preventingdamagingcurrentbackflowthroughthedevicewhenitispowereddown.

ORDERINGINFORMATION

(1)

T

A

PACKAGE

(2)

NanoStar™–WCSP(DSBGA)

0.23-mmLargeBump–YFP(Pb-free)

NanoStar™–WCSP(DSBGA)

0.23-mmLargeBump–YZP(Pb-free)

–40°Cto85°C

QFN–DRY

uQFN–DSF

SOT(SOT-23)–DBV

SOT(SC-70)–DCK

SOT(SOT-553)–DRL

(1)

(2)

(3)

Reelof3000

Reelof3000

Reelof5000

Reelof5000

Reelof3000

Reelof3000

Reelof4000

ORDERABLEPARTNUMBER

SN74AUP1G97YFPR

SN74AUP1G97YZPR

SN74AUP1G97DRYR

SN74AUP1G97DSFR

SN74AUP1G97DBVR

SN74AUP1G97DCKR

SN74AUP1G97DRLR

TOP-SIDEMARKING

(3)

___HP_

___HP_

HP

HP

H97_

HP_

Forthemostcurrentpackageandorderinginformation,seethePackageOptionAddendumattheendofthisdocument,orseetheTI

.

Packagedrawings,thermaldata,/packaging.

DBV/DCK/DRL:Theactualtop-sidemarkinghasoneadditionalcharacterthatdesignatesthewaferfab/assemblysite.

YFP/YZP:Theactualtop-sidemarkinghasthreeprecedingcharacterstodenoteyear,month,andsequencecode,andonefollowing

charactertodesignatethewaferfab/1identifierindicatessolder-bumpcomposition(1=SnPb,●=Pb-free).

FUNCTIONTABLE

INPUTS

C

L

L

L

L

H

H

H

H

B

L

L

H

H

L

L

H

H

A

L

H

L

H

L

H

L

H

OUTPUT

Y

L

L

H

H

L

H

L

H

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Copyright©2003–2010,TexasInstrumentsIncorporated