2024年4月19日发(作者：)

线路板流程术语中英文对照

流程简介：开料－－钻孔－－干膜制程－－压合－－减铜－－电镀－－塞孔－－防焊(绿漆/绿油)

－－镀金－－喷锡－－成型－－开短路测试－－终检－－雷射钻孔

A. 开料( Cut Lamination)

a-1 裁板( Sheets Cutting)

a-2 原物料发料(Panel)(Shear material to Size)

B. 钻孔(Drilling)

b-1 内钻(Inner Layer Drilling )

b-2 一次孔(Outer Layer Drilling )

b-3 二次孔(2nd Drilling)

b-4 雷射钻孔(Laser Drilling )(Laser Ablation )

b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)

C. 干膜制程( Photo Process(D/F))

c-1 前处理(Pretreatment)

c-2 压膜(Dry Film Lamination)

c-3 曝光(Exposure)

c-4 显影(Developing)

c-5 蚀铜(Etching)

c-6 去膜(Stripping)

c-7 初检( Touch-up)

c-8 化学前处理,化学研磨( Chemical Milling )

c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)

c-10 显影(Developing )

c-11 去膜(Stripping )

Developing , Etching & Stripping ( DES )

D. 压合Lamination

d-1 黑化(Black Oxide Treatment)

d-2 微蚀(Microetching)

d-3 铆钉组合(eyelet )

d-4 叠板(Lay up)

d-5 压合(Lamination)

d-6 后处理(Post Treatment)

d-7 黑氧化( Black Oxide Removal )

d-8 铣靶(spot face)

d-9 去溢胶(resin flush removal)

E. 减铜(Copper Reduction)

e-1 薄化铜(Copper Reduction)

F. 电镀(Horizontal Electrolytic Plating)

f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating)

f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)

f-3 低于1 mil ( Less than 1 mil Thickness )

f-4 高于1 mil ( More than 1 mil Thickness)

f-5 砂带研磨(Belt Sanding)

f-6 剥锡铅( Tin-Lead Stripping)