2024年6月2日发(作者:)

Si7617DN

Vishay Siliconix

P-Channel 30-V (D-S) MOSFET

PRODUCT SUMMARY

V

DS

(V)

-30

R

DS(on)

(Ω)

0.0123 at V

GS

= -10 V

0.0222 at V

GS

= -4.5 V

I

D

(A)

d, g

-35

-35

Q

g

(TYP.)

20.5 nC

FEATURES

•TrenchFET

®

power MOSFET

•100 % R

g

and UIS tested

•Material categorization:

for definitions of compliance please see

/doc?99912

PowerPAK

®

1212-8 Single

D

D

8

D

7

D

6

5

APPLICATIONS

•Notebook battery charging

•Notebook adapter switch

G

S

3

.

3

m

m

1

Top View

3

.

3

m

m

1

2

S

3

S

4

S

G

Bottom View

Ordering Information:

Si7617DN-T1-GE3 (Lead (Pb)-free and halogen-free)

D

P-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS (T

A

= 25 °C, unless otherwise noted)

Drain-Source Voltage

Gate-Source Voltage

T

C

= 25 °C

Continuous Drain Current (T

J

= 150 °C)

T

C

= 70 °C

T

A

= 25 °C

T

A

= 70 °C

Pulsed Drain Current

Continuous Source-Drain Diode Current

Avalanche Current

Single-Pulse Avalanche Energy

T

C

= 25 °C

T

A

= 25 °C

L = 0.1 mH

T

C

= 25 °C

Maximum Power Dissipation

T

C

= 70 °C

T

A

= 25 °C

T

A

= 70 °C

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)

e, f

T

J

, T

stg

P

D

I

DM

I

S

I

AS

E

AS

I

D

V

DS

V

GS

-30

± 25

-35

d

-35

d

-13.9

a, b

-11.1

a, b

-60

-35

d

-3

a, b

-29

42

52

33

3.7

a, b

2.4

a, b

-55 to +150

260

°C

W

mJ

A

V

ARAMETER SYMBOL LIMIT UNIT

THERMAL RESISTANCE RATINGS

ARAMETER SYMBOL PTYICAL MAXIMUM UNIT

Maximum Junction-to-Ambient

a, c

Maximum Junction-to-Case

t ≤ 10 s

Steady State

R

thJA

R

thJC

26

1.9

33

2.4

°C/W

Notes

e mounted on 1" x 1" FR4 board.

b.t = 10 s.

m under steady state conditions is 81 °C/W.

e limited.

solder profile (/doc?73257

). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

conditions: manual soldering with a soldering iron is not recommended for leadless components.

on T

C

= 25 °C.

S15-1032-Rev. B, 04-May-15

1

For technical questions, contact: **************************

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?91000

Document Number: 65164

Si7617DN

Vishay Siliconix

SPECIFICATIONS (T

J

= 25 °C, unless otherwise noted)

Static

Drain-Source Breakdown Voltage

V

DS

Temperature Coefficient

V

GS(th)

Temperature Coefficient

Gate-Source Threshold Voltage

Gate-Source Leakage

Zero Gate Voltage Drain Current

On-State Drain Current

a

Drain-Source On-State Resistance

a

Forward Transconductance

a

Dynamic

b

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

Total Gate Charge

Gate-Source Charge

Gate-Drain Charge

Gate Resistance

Turn-On Delay Time

Rise Time

Turn-Off DelayTime

Fall Time

Turn-On Delay Time

Rise Time

Turn-Off DelayTime

Fall Time

Drain-Source Body Diode Characteristics

Continuous Source-Drain Diode

Current

Pulse Diode Forward Current

Body Diode Voltage

Body Diode Reverse Recovery Time

Body Diode Reverse Recovery Charge

Reverse Recovery Fall Time

Reverse Recovery Rise Time

I

S

I

SM

V

SD

t

rr

Q

rr

t

a

t

b

I

F

= -11.1 A, dI/dt = 100 A/μs,

T

J

= 25 °C

I

S

= -11.1 A, V

GS

= 0 V

T

C

= 25 °C-

-

-

-

-

-

-

-

-

-0.8

33

30

18

16

-35

-60

-1.2

50

45

-

-

V

ns

nC

ns

A

C

iss

V

DS

= -15 V, V

GS

= 0 V, f = 1 MHzC

oss

C

rss

Q

g

Q

gs

R

g

t

d(on)

V

DD

= -15 V, R

L

= 1.35 Ω

I

D

≅ -11.1 A, V

GEN

= -10 V, R

g

= 1 Ω

t

d(off)

t

f

t

d(on)

V

DD

= -15 V, R

L

= 1.35 Ω

I

D

≅ -11.1 A, V

GEN

= -4.5 V, R

g

= 1 Ω

t

d(off)

t

f

t

r

t

r

V

DS

= -15 V, V

GS

= -10 V, I

D

= -13.9 A

V

DS

= -15 V, V

GS

= -4.5 V, I

D

= -13.9 A

f = 1 MHz

-

-

-

-

-

-

-

0.4

-

-

-

-

-

-

-

-

1800

370

312

39

20.5

6

11

2

11

9

32

9

40

43

30

11

-

-

-

59

31

-

-

4

22

18

50

18

60

65

45

22

ns

Ω

nC

pF

V

DS

ΔV

DS

/T

J

ΔV

GS(th)

/T

J

V

GS(th)

I

GSS

I

DSS

I

D(on)

R

DS(on)

g

fs

V

GS

= 0 V, I

D

= -250 μA

I

D

= -250 μA

V

DS

= V

GS

, I

D

= -250 μA

V

DS

= 0 V, V

GS

= ± 25 V

V

DS

= -30 V, V

GS

= 0 V

V

DS

= -30 V, V

GS

= 0 V, T

J

= 55 °C

V

DS

≥ -10 V, V

GS

= -10 V

V

GS

= -10 V, I

D

= -13.9 A

V

GS

= -4.5 V, I

D

= -10.3 A

V

DS

= -15 V, I

D

= -13.9 A

-30

-

-

-1.2

-

-

-

-30

-

-

-

-

-25

4.7

-

-

-

-

-

0.0103

0.0185

35

-

-

-

-2.5

± 100

-1

-5

-

0.0123

0.0222

-

V

mV/°C

V

nA

μA

A

Ω

S

ARAMETER SYMBOL TEST CONDITIONS PMIN.

Q

gd

Notes

test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.

teed by design, not subject to production testing.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation

of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

S15-1032-Rev. B, 04-May-15

2

For technical questions, contact: **************************

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?91000

Document Number: 65164