2024年6月13日发(作者:)

TECHNICAL DATA SHEET

PSR-4000 MP

(UL Name: PSR-4000MP / CA-40MP)

LIQUID PHOTOIMAGEABLE SOLDER MASK

Screen or Spray Application

Dark Green, Matte Finish

RoHS Compliant

Excellent Solder Ball Resistance

Compatible with Lead-Free Processing

Hard Surface Finish and Low Odor

Wide Processing Window

Fine Dam Resolution

Withstands ENIG & Immersion Tin

1 | PageRevised March 31, 2016

TECHNICAL DATA SHEET

P

ROCESSING

P

ARAMETERS FOR

PSR-4000

MP

PSR-4000 MP is a two-component, matte dark Green, alkaline developable LPI solder mask products

for flood screen and spray application methods. This product has a low odor, a wide process window

and is capable of withstanding alternate metal finishes such as ENIG and immersion Tin. It has a

matte Dark Green finish and provides excellent solder ball resistance in no clean flux assembly

applications. PSR-4000 MP meets or exceeds the requirements of IPC SM-840E Class H and Class

T, Bellcore GR-78-CORE Issue 1, and has a UL flammability rating of 94V-0. All Taiyo America

products comply with the Directive 2002/95/EC of the European Parliament and of the Council of 27

January 2003 on the Restriction of the use of certain Hazardous Substances (RoHS) in electrical and

electronic equipment.

PSR-4000

MP

C

OMPONENTS

PSR-4000MP /

Mixing Ratio 100 parts

Color Green

Mixed Properties

Solids 80%

Viscosity 140-180ps

Specific Gravity 1.58

CA-40MP

25 parts

White

M

IXING

PSR-4000 MP is supplied in pre-measured containers with a mix ratio by weight

of 100 parts PSR-4000 MP and 25 parts CA-40MP. PSR-4000 MP can be

mixed by hand with a mixing spatula for 10 – 15 minutes. Mixing can be done

with a mechanical mixer at low speeds to minimize shear thinning for 10 – 15

minutes. Also, mixing can be done with a paint shaker for 10 – 15 minutes.

Pot life after mixing is 72 hours when stored in a dark place at ≤ 25°C (77°F).

P

RE

-C

LEANING

Prior to solder mask application, the printed circuit board surface needs to be

cleaned. Various cleaning methods include Pumice, Aluminum Oxide,

Mechanical Brush, and Chemical Clean. All of these methods will provide a

clean surface for the application of PSR-4000 MP. Hold time after cleaning the

printed circuit board should be held to a minimum to reduce the oxidation of the

copper surfaces.

2 | PageRevised March 31, 2016