2024年6月13日发(作者：)

TAIYO PSR-4000 AUS320

LIQUID PHOTOIMAGEABLE SOLDER MASK

Designed for Packaging Applications

Halogen-Free (350 ppm)

Excellent Thermal and Crack Resistance

Hard Surface Finish

Excellent Adhesion to Molding Compounds

RoHS Compliant

Excellent Resistance to Electrolytic /

Electroless Gold Plating

Compatible with Lead-Free Processing

Excellent PCT Resistance

Revised March 2006

P

ROCESSING

P

ARAMETERS FOR

PSR-4000

AUS320

PSR-4000 AUS320 is a two-component, gloss Green, liquid photoimageable solder mask for

flood screen printing. PSR-4000 AUS320 has been specifically designed for BGA, Flip-Chip and

other Chip Scale Packaging (CSP) applications. PSR-4000 AUS320 has excellent crack

resistance along with resistance to electrolytic / elctroless gold plating lines. PSR-4000 AUS320

also has excellent PCT resistance. PSR-4000 AUS320 has a UL flammability rating of 94V-0.

All Taiyo America products comply with the Directive 2002/95/EC of the European Parliament

and of the Council of 27 January 2003 on the Restriction of the use of certain Hazardous

Substances (RoHS) in electrical and electronic equipment.

PSR-4000 AUS320

C

OMPONENTS

PSR-4000 AUS320 / CA-40 AUS320

Mixing Ratio 70 parts 30 parts

Color Green White

Mixed Properties

Solids 71%

Viscosity

140 – 160 ps

Specific Gravity 1.2

M

IXING

PSR-4000 AUS320 is supplied in pre-measured containers with a mix

ratio by weight of 70 parts PSR-4000 AUS320 and 30 parts CA-40

AUS320. PSR-4000 AUS320 can be mixed by hand with a mixing spatula

for 10 – 15 minutes. Mixing can be done with a mechanical mixer at low

speeds to minimize shear thinning for 10 – 15 minutes. Also, mixing can

be done with a paint shaker for 10 – 15 minutes. After mixing, the pot life

is 24 hours.

P

RE

-C

LEANING

Prior to solder mask application, the printed circuit board surface needs to

be cleaned. Various cleaning methods include Pumice, Aluminum Oxide,

Mechanical Brush, and Chemical Clean. All of these methods will provide

a clean surface for the application of PSR-4000 AUS320. Hold time after

cleaning the printed circuit board should be held to a minimum to reduce

the oxidation of the copper surfaces.

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P

ROCESSING

P

ARAMETERS FOR

PSR-4000

AUS320

S

CREEN

P

RINTING

Method: Single Sided and Double Sided Screening

•Screen Mesh: 83 – 110

•Screen Mesh Angle: 22.5° Bias

•Screen Tension: 20 - 28 Newtons

•Squeegee: 60 – 80 durometer

•Squeegee Angle: 27 – 35°

•Printing Mode: Flood / Print / Print

•Flood Pressure: 20 – 30 psi

•Printing Speed: 2.0 – 9.9 inches/sec

•Printing Pressure: 70 – 100 psi

T

ACK

D

RY

C

YCLE

The Tack Dry step is required to remove solvent from the solder mask

film and produce a firm dry surface. The optimum dwell time and oven

temperature will depend on oven type, oven loading, air circulation,

exhaust rate, and ramp times. Excessive tack dry times and temperature

will result in difficulty developing solder mask from through holes and a

reduction in photo speed. Insufficient tack dry will result in artwork

marking and/or sticking. Typical tack dry conditions for PSR-4000

AUS320 is as followed:

•

•

•

•

Oven Temperature: 160 - 180°F (71 - 82°C)

For Single-Sided (Batch Oven)

1

st

Side: Dwell Time: 15 - 20 minutes

nd

Dwell Time: 35 - 45 minutes

2

Side:

For Double-Sided (Conveyorized or Batch Oven)

Dwell Time: 35 – 60 minutes

E

XPOSURE

PSR-4000 AUS320 requires UV exposure to define solder mask dams

and features. The spectral sensitivity of PSR-4000 AUS320 is in the area

of 365 nm. Exposure times will vary by bulb type and age of the bulb.

Below are guidelines for exposing PSR-4000 AUS320.

•

•

•

Exposure Unit: 7 kW or higher

Stouffer Step 21: Clear 7 minimum (on metal / under phototool)

Energy: Minimum 500 mJ / cm

2

(under phototool)

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P

ROCESSING

P

ARAMETERS FOR

PSR-4000

AUS320

D

EVELOPMENT

PSR-4000 AUS320 is developed in an aqueous sodium or potassium

carbonate solution. Developing can be done in either a horizontal or

vertical machine.

•

•

•

•

•

•

Solution: 1% by wt. Sodium Carbonate or 1.2% Potassium Carbonate

pH: 10.6 or greater

Temperature: 85 - 95°F (29 - 35°C)

Spray Pressure: 25 - 45 psi

Dwell Time in developing chamber: 90 - 120 seconds

Water rinse is needed to remove developer solution & dry

F

INAL

C

URE

PSR-4000 AUS320 needs to be thermally cured to insure optimal final property

performance. Thermal curing can be done in a batch oven or conveyorized oven.

•

•

Temperature: 275 - 300°F (135 - 149°C)

Time at Temperature: 45 - 60 minutes

UV

C

URE

PSR-4000 AUS320 also requires a UV cure to insure optimal final property

performance. The recommended process for UV curing is as follows:

•

•

UV Energy: 3000 mJ / cm

2

Lamps: High Pressure Mercury Lamps

For Process Optimization, please contact your local Taiyo America Representative

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F

INAL

P

ROPERTIES FOR

PSR-4000

AUS320

TEST

Adhesion

Pencil Hardness

Solder Heat Resistance

Solvent Resistance

Acid Resistance

Alkaline Resistance

Insulation Resistance

REQUIREMENT

JIS D0202 Cross-hatch test

No scratch on copper

Rosin based flux: 260°C / 10sec. X 3 cycle of solder float

PGM-AC 20°C / 30 mins. Immersion and tape-peeling

10 vol.% H

2

SO

4

, 20°C/30 min. immersion and tape-peeling

10 vol.% NaOH, 20°C/30 min. immersion and tape-peeling

IPC Comb type (B-pattern)

Humidification: 25~65°C cycle 90%RH DC100V

loading for 7 days

Measurement: After the above treatment, loading DC500V

for 1 minute at room temp.

Values at 1 MHz

Humidification: 25~65°C cycle 90%RH for 7 days

Measurement: After the above treatment, reading at RT

Values at 1 MHz

Humidification: 25~65°C cycle 90%RH for 7 days

RESULT

100 / 100

7H

Pass

Pass

Pass

Pass

Initial

8.8 x 10

13

ohms

Conditioned

1.1 x 10

12

ohms

Initial4.0

Conditioned 4.3

Initial 0.019

Conditioned 0.023

Dielectric Constant

Dielectric Loss tangent

Surface Resistivity

Volume Resistivity

Young Modulus

Breaking Strength

Elongation

Electroless Ni/Au

Resistance

Electrolytic Ni/Au

Resistance

Tg

C.T.E

Measurement: After the above treatment, reading at RT

Internal Test 1.1 x 10

12

ohms

Internal Test

8.9 x 10

14

ohms•cm

Pulling Test 3400 MPa

Pulling Test 70 MPa

PullingTest3.5%

Internal Test:

Pass

Ni 5 µm Au 1 µm

Internal Test:

Pass

Ni 3 µm Au 0.03 µm

TMA method (pulling test)

114°C

60 ppm

TMA method (pulling test)Below Tg

Above Tg 130 ppm

Taiyo America, Inc. (TAIYO) warrants its products to be free from defects in materials and workmanship for the specified warranty period (PSR-4000

o

AUS320 / CA-40 AUS320 Warranty period is 3 Months) provided the customer has, at all times, stored the ink at a temperature of 68

F or less. TAIYO

accepts no responsibility or liability for damages, whether direct, indirect, or consequential, resulting from failure in the performance of its products. If a

TAIYO product is found to be defective in material or workmanship, its liability is limited to the purchase price of the product found to be defective. TAIYO

MAKES NO OTHER WARRANTY, EXPRESS OR IMPLIED, AND MAKES NO WARRANTY OF MERCHANTABILITY OR OF FITNESS FOR ANY

PARTICULAR PURPOSE. TAIYO'S obligation under this warranty shall not include any transportation charges or costs of installation or any liability for

direct, indirect, or consequential damages or delay. If requested by TAIYO, products for which a warranty claim is made are to be returned transportation

prepaid to TAIYO'S factory. Any improper use or any alteration of TAIYO'S product by the customer, as in TAIYO'S judgment affects the product

materially and adversely, shall void this limited warranty.

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