2024年4月27日发(作者:)

1

CPU 3DNow!

3D no waiting

ALU

Arithmetic Logic Unit

,算术逻辑单元)

AGU

Address Generation Units

,地址产成单元)

BGA

Ball Grid Array

,球状矩阵排列)

BHT

branch prediction table

,分支预测表)

BPU

Branch Processing Unit

,分支处理单元)

Brach Pediction

(分支预测)

CMOS: Complementary Metal Oxide Semiconductor

,互补金属氧化物半导体

CISC

Complex Instruction Set Computing

,复杂指令集计算机)

CLK

Clock Cycle

,时钟周期)

COB

Cache on board

,板上集成缓存)

COD

Cache on Die

,芯片内集成缓存)

CPGA

Ceramic Pin Grid Array

,陶瓷针型栅格阵列)

CPU

Center Processing Unit

,中央处理器)

Data Forwarding

(数据前送)

Decode

(指令解码)

DIB

Dual Independent Bus

,双独立总线)

EC

Embedded Controller

,嵌入式控制器)

Embedded Chips

(嵌入式)

EPIC

explicitly parallel instruction code

,并行指令代码)

FADD

Floationg Point Addition

,浮点加)

FCPGA

Flip Chip Pin Grid Array

,反转芯片针脚栅格阵列)

FDIV

Floationg Point Divide

,浮点除)

FEMMS

Fast Entry/Exit Multimedia State

,快速进入

/

退出多媒体状态

FFT

fast Fourier transform

,快速热欧姆转换)

FID

FID

Frequency identify

,频率鉴别号码)

FIFO

First Input First Output

,先入先出队列)

flip-chip

(芯片反转)

FLOP

Floating Point Operations Per Second

,浮点操作

/

秒)

FMUL

Floationg Point Multiplication

,浮点乘)

FPU

Float Point Unit

,浮点运算单元)

FSUB

Floationg Point Subtraction

,浮点减)

GVPP

Generic Visual Perception Processor

,常规视觉处理器)

HL-PBGA:

表面黏著

,

高耐热、轻薄型塑胶球状矩阵封装

IA

Intel Architecture

,英特尔架构)

ICU

Instruction Control Unit

,指令控制单元)

ID

identify

,鉴别号码

IDF

Intel Developer Forum

,英特尔开发者论坛)

IEU

Integer Execution Units

,整数执行单元)

IMM: Intel Mobile Module,

英特尔移动模块

Instructions Cache

,指令缓存

Instruction Coloring

(指令分类)

IPC

Instructions Per Clock Cycle

,指令

/

时钟周期)

ISA

instruction set architecture

,指令集架构)

KNI

Katmai New Instructions

Katmai

新指令集,即

SSE

Latency

(潜伏期)

LDT

Lightning Data Transport

,闪电数据传输总线)

Local Interconnect

(局域互连)

MESI

Modified, Exclusive, Shared, Invalid

:修改、排除、共享、废弃)

MMX

MultiMedia Extensions

,多媒体扩展指令集)

MMU

Multimedia Unit

,多媒体单元)

MFLOPS

Million Floationg Point/Second

,每秒百万个浮点操作)

MHz

Million Hertz

,兆赫兹)

MP

Multi-Processing

,多重处理器架构)

MPS

MultiProcessor Specification

,多重处理器规范)

MSRs

Model-Specific Registers

,特别模块寄存器)

NAOC

no-account OverClock

,无效超频)

NI

Non

Intel

,非英特尔

OLGA

Organic Land Grid Array

,基板栅格阵列)

OoO

Out of Order

,乱序执行)

PGA: Pin-Grid Array

(引脚网格阵列)

Post-RISC

PR

Performance Rate,

性能比率)

PSN

Processor Serial numbers,

处理器序列号)

PIB

Processor In a Box

,盒装处理器)

PPGA

Plastic Pin Grid Array

,塑胶针状矩阵封装)

PQFP

Plastic Quad Flat Package

,塑料方块平面封装)

RAW

Read after Write

,写后读)

Register Contention

(抢占寄存器)

Register Pressure

(寄存器不足)

Register Renaming

(寄存器重命名)

Remark

(芯片频率重标识)

Resource contention

(资源冲突)

Retirement

(指令引退)

RISC

Reduced Instruction Set Computing

,精简指令集计算机)

SEC: Single Edge Connector

,单边连接器

Shallow-trench isolation

(浅槽隔离)

SIMD

Single Instruction Multiple Data

,单指令多数据流)

SiO2F

Fluorided Silicon Oxide

,二氧氟化硅)

SMI

System Management Interrupt

,系统管理中断)

SMM

System Management Mode

,系统管理模式)

SMP

Symmetric Multi-Processing

,对称式多重处理架构)

SOI: Silicon-on-insulator

,绝缘体硅片

SONC

System on a chip

系统集成芯片)

SPEC

System Performance Evaluation Corporation

,系统性能评估测试)

SQRT

Square Root Calculations

,平方根计算)

SSE

Streaming SIMD Extensions

,单一指令多数据流扩展)

Superscalar

(超标量体系结构)

,

耗电大