2024年4月17日发(作者：)

High-density performance line Arm

®

-based 32-bit MCU with 256 to 512KB

Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces

Datasheet

−

production data

Features

•Core: Arm

®

32-bit Cortex

®

-M3 CPU

–72 MHz maximum frequency, 1.25DMIPS/MHz

(Dhrystone 2.1) performance at 0 wait state

memory access

Single-cycle multiplication and hardware

division

256 to 512 Kbytes of Flash memory

up to 64 Kbytes of SRAM

Flexible static memory controller with 4 Chip

Select. Supports Compact Flash,

SRAM,

PSRAM, NOR and NAND memories

LCD parallel interface, 8080/6800 modes

2.0 to 3.6V application supply and I/Os

POR, PDR, and programmable voltage detector

(PVD)

4-to-16 MHz crystal oscillator

Internal 8 MHz factory-trimmed RC

Internal 40 kHz RC with calibration

32 kHz oscillator for RTC with calibration

Sleep, Stop and Standby modes

V

BAT

supply for RTC and backup registers

LQFP64 10 × 10 mm,

LQFP100 14 × 14 mm,

LQFP144 20 × 20 mm

WLCSP64

LFBGA100 10 × 10 mm

LFBGA144 10 × 10 mm

–

•Up to 11 timers

–Up to four 16-bit timers, each with up to 4

IC/OC/PWM or pulse counter and quadrature

(incremental) encoder input

2 × 16-bit motor control PWM timers with dead-

time generation and emergency stop

2 × watchdog timers (Independent and Window)

SysTick timer: a 24-bit downcounter

2 × 16-bit basic timers to drive the DAC

Up to 2 × I

2

C interfaces (SMBus/PMBus)

Up to 5 USARTs (ISO 7816 interface, LIN, IrDA

capability, modem control)

Up to 3 SPIs (18 Mbit/s), 2 with I

2

S interface

multiplexed

CAN interface (2.0B Active)

USB 2.0 full speed interface

SDIO interface

•Memories

–

–

–

–

–

–

–

–

–

–

–

–

–

–

–

–

–

–

–

–

–

–

•Clock, reset and supply management

•Up to 13 communication interfaces

•Low power

•CRC calculation unit, 96-bit unique ID

•ECOPACK

®

packages

Table summary

Reference

STM32F103xC

STM32F103xD

STM32F103xE

Part number

STM32F103RC STM32F103VC

STM32F103ZC

STM32F103RD STM32F103VD

STM32F103ZD

STM32F103RE STM32F103ZE

STM32F103VE

•3 × 12-bit, 1 µs A/D converters (up to 21

channels)

–

–

–

Conversion range: 0 to 3.6 V

Triple-sample and hold capability

Temperature sensor

•2 × 12-bit D/A converters

•DMA: 12-channel DMA controller

–Supported peripherals: timers, ADCs, DAC,

SDIO, I

2

Ss, SPIs, I

2

Cs and USARTs

Serial wire debug (SWD) & JTAG interfaces

Cortex

®

-M3 Embedded Trace Macrocell™

51/80/112 I/Os, all mappable on 16 external

interrupt vectors and almost all 5V-tolerant

•Debug mode

–

–

–

•Up to 112 fast I/O ports

July 2018DS5792 Rev 13

Electrical characteristicsSTM32F103xC, STM32F103xD, STM32F103xE

High-speed external clock generated from a crystal/ceramic resonator

The high-speed external (HSE) clock can be supplied with a 4 to 16 MHz crystal/ceramic

resonator oscillator. All the information given in this paragraph are based on

characterization results obtained with typical external components specified in Table23. In

the application, the resonator and the load capacitors have to be placed as close as

possible to the oscillator pins in order to minimize output distortion and startup stabilization

time. Refer to the crystal resonator manufacturer for more details on the resonator

characteristics (frequency, package, accuracy).

Table 23. HSE 4-16 MHz oscillator characteristics

(1)(2)

Symbol

f

OSC_IN

R

F

C

Parameter

Oscillator frequency

Feedback resistor

Recommended load capacitance

versus equivalent serial

resistance of the crystal (R

S

)

(3)

HSE driving current

Oscillator transconductance

Conditions

-

-

R

S

= 30 Ω

V

DD

= 3.3 V, V

IN

=V

SS

with 30 pF load

Startup

V

DD

is stabilized

Min

4

-

-

Typ

8

200

30

Max

16

-

-

Unit

MHz

kΩ

pF

i

2

g

m

-

25

-

-

-

2

1

-

-

mA

mA/V

ms

t

SU(HSE)

(4)

Startup time

teed by characterization results.

tor characteristics given by the crystal/ceramic resonator manufacturer.

relatively low value of the RF resistor offers a good protection against issues resulting from use in a

humid environment, due to the induced leakage and the bias condition change. However, it is

recommended to take this point into account if the MCU is used in tough humidity conditions.

4.t

SU(HSE)

is the startup time measured from the moment it is enabled (by software) to a stabilized 8 MHz

oscillation is reached. This value is measured for a standard crystal resonator and it can vary significantly

with the crystal manufacturer

For C

L1

and C

L2

, it is recommended to use high-quality external ceramic capacitors in the

5pF to 25pF range (typ.), designed for high-frequency applications, and selected to match

the requirements of the crystal or resonator (see Figure22). C

L1

and C

L2

are usually the

same size. The crystal manufacturer typically specifies a load capacitance which is the

series combination of C

L1

and C

L2

. PCB and MCU pin capacitance must be included (10pF

can be used as a rough estimate of the combined pin and board capacitance) when sizing

C

L1

and C

L2

. Refer to the application note AN2867 “Oscillator design guide for ST

microcontrollers” available from the ST website .

Figure 22. Typical application with an 8 MHz crystal

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