2024年5月10日发(作者:)
AP0504GMT-HF
Halogen-Free Product
Advanced Power
Electronics Corp.
Simple Drive Requirement
SO-8 Compatible with Heatsink
Low On-resistance
RoHS Compliant & Halogen-Free
G
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
D
BV
DSS
R
DS(ON)
I
D
40V
5.5m
75A
D
S
D
D
D
Description
Advanced Power MOSFETs from APEC provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and cost-effectiveness.
The PMPAK 5x6 package is special for DC-DC converters application
and the foot print is compatible with SO-8 with backside heat sink and
lower profile.
S
S
S
G
PMPAK 5x6
Absolute Maximum Ratings
Symbol
V
DS
V
GS
I
D
@T
C
=25
I
D
@T
A
=25
I
D
@T
A
=70
I
DM
P
D
@T
C
=25
P
D
@T
A
=25
E
AS
T
STG
T
J
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Chip)
Continuous Drain Current
Pulsed Drain Current
1
3
Rating
40
+20
75
23.6
19
300
56.8
5
28.8
-55 to 150
-55 to 150
Units
V
V
A
A
A
A
W
W
mJ
Continuous Drain Current
3
Total Power Dissipation
Total Power Dissipation
Single Pulse Avalanche Energy
4
Storage Temperature Range
Operating Junction Temperature Range
Thermal Data
Symbol
Rthj-c
Rthj-a
Parameter
Maximum Thermal Resistance, Junction-case
Maximum Thermal Resistance, Junction-ambient
3
Value
2.2
25
Units
/W
/W
Data & specifications subject to change without notice1
200911101
AP0504GMT-HF
Electrical Characteristics@T
j
=25
o
C(unless otherwise specified)
Symbol
BV
DSS
R
DS(ON)
Parameter
Drain-Source Breakdown Voltage
Static Drain-Source On-Resistance
2
Test Conditions
V
GS
=0V, I
D
=250uA
V
GS
=10V, I
D
=30A
V
GS
=4.5V, I
D
=20A
V
GS(th)
g
fs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
Gate Threshold Voltage
Forward Transconductance
Drain-Source Leakage Current
Gate-Source Leakage
Total Gate Charge
2
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
2
Min.
40
-
-
1
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ.
-
-
-
-
70
-
-
20
4
11
9
7
25
29
340
180
-
5.5
8
3
-
10
+100
32
-
-
-
-
-
-
-
-
V
m
m
V
S
uA
nA
nC
nC
nC
ns
ns
ns
ns
pF
pF
pF
V
DS
=V
GS
, I
D
=250uA
V
DS
=10V, I
D
=20A
V
DS
=40V, V
GS
=0V
V
GS
=+20V
I
D
=20A
V
DS
=20V
V
GS
=4.5V
V
DS
=20V
I
D
=1A
R
G
=3.3,V
GS
=10V
R
D
=20
V
GS
=0V
V
DS
=25V
f=1.0MHz
16402620
Source-Drain Diode
Symbol
V
SD
Parameter
Forward On Voltage
2
Test Conditions
I
S
=20A, V
GS
=0V
I
S
=10A,
V
GS
=0
V
,
dI/dt=100A/µs
Min.
-
-
-
Typ.
-
31
29
1.2
-
-
V
ns
nC
t
rr
Q
rr
Reverse Recovery Time
2
Reverse Recovery Charge
Notes:
width limited by Max. junction temperature
test
e mounted on 1 in
2
copper pad of FR4 board, t <10sec, 60
o
C/W at steady state.
ng T
j
=25C , V
DD
=30V , L=0.1mH , R
G
=25 , I
AS
=24A.
o
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
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